Invisible laser cutting (Tokyo Precision ML200)


Instrument Introduction

Invisible cutting equipment, using laser cutting method, can achieve high-quality and high-speed processing of MEMS products and thin wafers. The main advantages are: dry processing technology, no need to clean, suitable for processing objects with poor load resistance (such as MEMS); the width of the cutting groove can be very narrow, which helps to reduce the cutting path; at the same time it can suppress the generation of processing debris . It can cut silicon wafers and glass wafers of 8 inches and below.