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The required photoresist film is coated on the substrate by spin coating, and the thickness of the film is precisely controlled by adjusting the rotation speed. Suitable for the coating of positive and negative photoresists of various viscosities, the maximum speed can reach 10000 rpm, automatic glue dropping device, automatic program operation, precise control of glue thickness.

Main Specifications:

Film thickness uniformity:

±3% (6"wafer);

Substrate size:

5mm*5mm～100mm*100mm chip, Φ2"～Φ6"wafer;